Faculty

Institution

Unit

Venue

Suresh K. Sitaraman

Regents' Professor and Morris M Bryan Jr Professor in Mechanical Engineering

Georgia Institute of Technology

Affiliations

College of Engineering

George W. Woodruff School of Mechanical Engineering

Suresh K. Sitaraman is currently serving as a College Of Engineering Regents' Professor and Morris M Bryan Jr Professor in Mechanical Engineering at Georgia Institute of Technology.

Honors

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Experiences

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Education

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Suresh K. Sitaraman

Georgia Institute of Technology

Regents' Professor and Morris M Bryan Jr Professor in Mechanical Engineering

You can click a keyword to filter the displayed items

electrical engineering materials science electronic packaging engineering microelectronics materials engineering applied physics reliability printed electronics advanced packaging (semiconductors) reliability engineering optoelectronics electronics manufacturing technology electronic materials thermal engineering flexible electronics advanced manufacturing technologies additive manufacturing component technology manufacturing structural mechanics power electronics advanced materials manufacturing engineering microelectronics reliability device reliability composite science manufacturing science solid-state electronics microwave technology mechanical science hardware reliability wearable electronics polymer technology tribology experimental analysis through-silicon vias surface modification organic electronics semiconductor device fabrication metal processing semiconductor technology interconnect (integrated circuits) surface nanotechnology polymer engineering reliability assessment flip-chip assemblies compliant interconnects flexible manufacturing technology surface engineering micro-electromechanical systems micro technology thermal cycling interfacial delamination reliability analysis fatigue management 5g system reliability prediction copper-epoxy interface next-generation packaging substrate warpage interfacial delamination propagation silicon vias material modeling surface processing structural reliability thermomechanical processing intermittently connected device defect tolerance glass material nanoindentation technique carbon nanotube forests cyclic loading experimental characterization rdl stress computer-aided design digital fabrication reliable design microfabrication mechanics of materials computer-aided engineering mechanical engineering

Notable Scholarly Works

Notable Federal Grants

Collaborators

Electrical Behavior of Thin Die Assembly on Flexible Substrate Under Vibration Testing. (2024)

Sara LiebermanEl Mehdi AbbaraNathaniel GeeK. U. S. SomarathnaBabatunde FalolaAbhishek NavkarAbdullah ObeidatZhi DouMohammed AlhendiPeter BorgesenSuresh K SitaramanMark D. Poliks

thin die assemblyflexible substrateflexible electronicselectrical engineeringelectrical behavior

Experimental and Modeling Study of Rf Performance of a Screen-Printed Coplanar Waveguide (Cpw) Up to 20 Ghz Under Monotonic Stretching. IEEE Transactions on Components Packaging and Manufacturing Technology (2024)

Yi ZhouJustin H. ChowManos M. TentzerisSuresh K. Sitaraman

advanced packaging (semiconductors)monotonic stretchingelectronic packagingelectronicsscreen-printed coplanar waveguidemicrowave technologyelectrical engineeringplanar waveguide sensorcomponent technologyrf performance

Flexible/Conformal Inkjet-Printed 3-D “Ramp” Interconnects for 5G/Mmwave System-On-Package Designs and Wearable Applications. IEEE Transactions on Components Packaging and Manufacturing Technology (2024)

Kexin HuYi ZhouSuresh K. SitaramanManos M. Tentzeris

wearable technologyprinted electronicselectronic packaging3d bioprintingvlsi technologyadditive manufacturingmicrofabricationcomputer engineeringrapid prototypingsolid-state electronics3d printingwearable applicationsmechanical engineeringcontinuous deploymentflexible electronicsmicrowave technologysystem-on-package designsadvanced packaging (semiconductors)electrical engineeringreal-world deployment

Investigation of Mechanical Reliability of Flexible/Stretchable Electronic Materials Using Multi-Axial Stretch Techniques. (2024)

Nathan S. MorganKaushik U. GodboleBenjamin G. StewartSuresh K. SitaramanNicholas J. Ginga

materials sciencemulti-axial stretch techniquesmechanical engineeringflexible electronicsengineeringmechanical reliability

Machine-Learning Guided Strain-Relief Patterns for Maximizing Stretchability of Printed Conductors. (2024)

Rui ChenSuresh K. Sitaraman

materials sciencestrain-relief patternsprinted conductorsflexible electronicsmachine learning

Parametric Thermal Design for Heterogeneously Integrated High-Power Packages. (2024)

Yunhyeok ImJunyoung KimMingeun ChoiMyriam BouzidiXingchen LiJoon Woo KimAhmet Mete MusluSatish KumarMadhavan SwaminathanSuresh K. SitaramanYogendra Joshi

parametric thermal designcomputer engineeringthermal engineeringthermal modelingelectronic packagingelectrical engineeringpower electronicshigh-power packagesengineeringheat transfer

Additively Manufactured Flexible Material Characterization and On-Demand “Smart” Packaging Topologies for 5G/Mmwave Wearable Applications. (2023)

Kexin HuYi ZhouSuresh K. SitaramanManos M. Tentzeris

materials sciencewearable technologywearable applicationsmechanical engineeringsmart manufacturingmaterials engineeringelectronic packagingadvanced manufacturing technologiesflexible electronicselectrical engineeringflexible material characterizationpackaging topologieswearable electronicsadditive manufacturing

Additively Manufactured Flexible On-Package Phased Array Antennas for 5G/Mmwave Wearable and Conformal Digital Twin and Massive Mimo Applications. Scientific Reports (2023)

Kexin HuYi ZhouSuresh K SitaramanManos M Tentzeris

scientific computingwearable technology5g systemflexible on-packagemechanical engineeringflexible manufacturing technologymassive mimo applicationsarray antennasmimo systemflexible electronicselectrical engineeringmicrowave technologyconformal digital twinwearable electronicsoptoelectronicsmillimeter wave technologyadditive manufacturing

Crowbar Loading-a New Test Technique to Characterize Interfacial Delamination. Engineering Fracture Mechanics (2023)

V.N.N. Trilochan RambhatlaSuresh K. Sitaraman

materials sciencemechanical engineeringinterfacial delaminationstructural testingengineering

Magnetic Force-Based Measurement Technique to Investigate the Effect of Lead-Free Solder Intermetallic Compounds (Imc) on Interconnect Reliability. (2023)

Nicholas J. GingaRui ChenSuresh K. Sitaraman

interconnect reliabilitymaterials sciencemagnetismelectrical engineeringmicroelectronicspower electronicsapplied physics

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Suresh K. Sitaraman

Regents' Professor and Morris M Bryan Jr Professor in Mechanical Engineering

Georgia Institute of Technology

Affiliations

College of Engineering

George W. Woodruff School of Mechanical Engineering

Suresh K. Sitaraman is currently serving as a College Of Engineering Regents' Professor and Morris M Bryan Jr Professor in Mechanical Engineering at Georgia Institute of Technology.

Honors

Create free account to unlock more features

Experiences

Create free account to unlock more features

Education

Create free account to unlock more features

Suresh K. Sitaraman

Georgia Institute of Technology

Regents' Professor and Morris M Bryan Jr Professor in Mechanical Engineering

You can click a keyword to filter the displayed items

Notable Scholarly Works

Notable Federal Grants

Collaborators

Electrical Behavior of Thin Die Assembly on Flexible Substrate Under Vibration Testing. (2024)

Sara LiebermanEl Mehdi AbbaraNathaniel GeeK. U. S. SomarathnaBabatunde FalolaAbhishek NavkarAbdullah ObeidatZhi DouMohammed AlhendiPeter BorgesenSuresh K SitaramanMark D. Poliks

thin die assemblyflexible substrateflexible electronicselectrical engineeringelectrical behavior

Yi ZhouJustin H. ChowManos M. TentzerisSuresh K. Sitaraman

Kexin HuYi ZhouSuresh K. SitaramanManos M. Tentzeris

Investigation of Mechanical Reliability of Flexible/Stretchable Electronic Materials Using Multi-Axial Stretch Techniques. (2024)

Nathan S. MorganKaushik U. GodboleBenjamin G. StewartSuresh K. SitaramanNicholas J. Ginga

materials sciencemulti-axial stretch techniquesmechanical engineeringflexible electronicsengineeringmechanical reliability

Machine-Learning Guided Strain-Relief Patterns for Maximizing Stretchability of Printed Conductors. (2024)

Rui ChenSuresh K. Sitaraman

materials sciencestrain-relief patternsprinted conductorsflexible electronicsmachine learning

Parametric Thermal Design for Heterogeneously Integrated High-Power Packages. (2024)

Yunhyeok ImJunyoung KimMingeun ChoiMyriam BouzidiXingchen LiJoon Woo KimAhmet Mete MusluSatish KumarMadhavan SwaminathanSuresh K. SitaramanYogendra Joshi

parametric thermal designcomputer engineeringthermal engineeringthermal modelingelectronic packagingelectrical engineeringpower electronicshigh-power packagesengineeringheat transfer

Additively Manufactured Flexible Material Characterization and On-Demand “Smart” Packaging Topologies for 5G/Mmwave Wearable Applications. (2023)

Kexin HuYi ZhouSuresh K. SitaramanManos M. Tentzeris

Additively Manufactured Flexible On-Package Phased Array Antennas for 5G/Mmwave Wearable and Conformal Digital Twin and Massive Mimo Applications. Scientific Reports (2023)

Kexin HuYi ZhouSuresh K SitaramanManos M Tentzeris

Crowbar Loading-a New Test Technique to Characterize Interfacial Delamination. Engineering Fracture Mechanics (2023)

V.N.N. Trilochan RambhatlaSuresh K. Sitaraman

materials sciencemechanical engineeringinterfacial delaminationstructural testingengineering

Magnetic Force-Based Measurement Technique to Investigate the Effect of Lead-Free Solder Intermetallic Compounds (Imc) on Interconnect Reliability. (2023)

Nicholas J. GingaRui ChenSuresh K. Sitaraman

interconnect reliabilitymaterials sciencemagnetismelectrical engineeringmicroelectronicspower electronicsapplied physics

1
2
3
4
5
28
10 / page

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3d ic architecture

chip on board

Samuel Graham

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microscale heat transfer

physical properties

Rao Tummala

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nanotechnology

medical electronics

Raj Pulugurtha

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medical electronics

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Mark G. Allen

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electromagnetic compatibility

sustainable development

Jeffrey Suhling

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Mark D. Poliks

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design

industrial design

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nano energy

nanomaterials