Faculty

Institution

Unit

Venue

Madhavan Swaminathan

Professor Emeritus

Georgia Institute of Technology

Affiliations

College of Engineering

School of Civil and Environmental Engineering

School of Materials Science and Engineering

School of Civil and Environmental Engineering

Transportation Systems Engineering

Madhavan Swaminathan is currently serving as a College Of Engineering Professor Emeritus at Georgia Institute of Technology.

Honors

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Experiences

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Education

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Madhavan Swaminathan

Georgia Institute of Technology

Professor Emeritus

You can click a keyword to filter the displayed items

electrical engineering engineering power electronics electronic packaging microwave technology microelectronics applied physics optoelectronics systems engineering microwave engineering manufacturing technology advanced packaging (semiconductors) manufacturing component technology machine learning electronics computational electromagnetics advanced manufacturing technologies radio frequency printed electronics materials engineering manufacturing engineering electromagnetic compatibility semiconductors integrated circuits organic electronics thermal engineering power delivery networks vlsi technology signal integrity radio engineering glass interposer power delivery power engineering manufacturing science filter design 5g system interconnect (integrated circuits) 6g liquid crystalline polymer wireless communications polymer engineering electronic materials device integration rf subsystem additive manufacturing intermittently connected device circuit simulation semiconductor technology electronic engineering power integrity power supply noise engineering optimization millimeter wave technology wireless propagation power distribution networks organic substrates power transmission lines vlsi circuit device modeling high-frequency devices rf semiconductor semiconductor device fabrication vlsi design microwave antennas chip-scale package transmission matrix method integrated voltage regulators inverse design advanced design nanocomposites high speed systems noise suppression rf applications electrical modeling electromagnetic modeling human welfare technology energy institute industrial iot sustainable development sustainability science environmental impact assessment industrial hazard ohmic heating environmental impact of the energy industry sustainable energy clean technology sustainable design

Video Presentations

Notable Scholarly Works

Notable Federal Grants

Collaborators

Air-Filled Siws Using Laminate Dielectrics on Glass Substrate for D-Band Applications. IEEE Transactions on Components Packaging and Manufacturing Technology (2024)

Mutee ur RehmanLakshmi Narasimha Vijay KumarSerhat ErdoganMadhavan Swaminathan

power electronicsmaterials scienceglass substrateelectrical engineeringcomponent technologyd-band applicationsprinted electronicssemiconductor deviceselectronicsadvanced manufacturing technologieselectronic packagingmanufacturing technologyengineeringsemiconductorslaminate dielectricsmanufacturingsemiconductor technologyair-filled siwsmanufacturing engineering

A Low Loss Die-Embedded Glass Substrate for 140 Ghz Inp Power Amplifier Integration. 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022 (2024)

Xiaofan JiaXingchen LiJoon Woo KimKyoung-sik MoonMark J.W. RodwellMadhavan Swaminathan

power electronicsnanoelectronicsadvanced packaging (semiconductors)engineeringmicrowave engineeringmicrowave technologyvlsi designghz inp powermicroelectronicscomputer engineeringsemiconductorssolid-state electronicselectronic materialselectronicselectrical engineering

Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications. IEEE Transactions on Components Packaging and Manufacturing Technology (2024)

Shreya DwarakanathPragna BhaskarKimiyuki KannoPratik C NimbalkarMohanalingam KathaperumalMarkondeya Raj PulugurthaMadhavan SwaminathanRao R Tummala

component technologyadvanced packaging applicationsadvanced packaging (semiconductors)polymer materialsadvanced materialspolymer dielectric materialsmaterials sciencecharacterization (materials science)manufacturing technology

CORRECTION: Nimbalkar Et Al. a Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates. Polymers 2023, 15, 3895. Polymers (2024)

Pratik NimbalkarPragna BhaskarMohanalingam KathaperumalMadhavan SwaminathanRao R. Tummala

redistribution layerspolymer materialspolymer engineeringmaterials sciencepolymer sciencepolymer dielectricspackage substrates

Design and Demonstration of Dual-Core Spiral Package-Embedded Inductors for 48V-To-1V and 12V-To-1V Integrated Voltage Regulators. (2024)

Venkatesh AvulaPrahalad MuraliMadhavan Swaminathan

Design Considerations for DC-DC Voltage Regulators in Distributed Vertical Power Delivery Systems. 2022 IEEE International Symposium on Circuits and Systems (ISCAS) (2024)

Sriharini KrishnakumarMingeun ChoiRamin Rahimzadeh KhorasaniRohit SharmaMadhavan SwaminathanSatish KumarInna Partin-Vaisband

power electronicsenergy storagedc-dc voltage regulatorsdesign considerationselectrical engineering

Efficient Monostatic Anisotropic Point Scatterer Model for High Performance Computing. Journal of Electromagnetic Waves and Applications (2024)

Eric HuangMadhavan Swaminathan

computational electromagneticsapplied mathematicsapplied physicselectromagnetismelectrical engineering

Glass Interposer Integration of Logic and Memory Chiplets: Ppa and Power/Signal Integrity Benefits. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (2024)

Pruek Vanna-IampikulSeungmin WooSerhat ErdoganLingjun ZhuMohanalingam KathaperumalRavi AgarwalRam GuptaKevin RineboldMadhavan SwaminathanSung Kyu Lim

nanoengineeringelectrical engineeringglass interposer integrationmemory chiplets

Glass Interposer With Multiple Embedded Dies for Mmwave Applications. IEEE Transactions on Components Packaging and Manufacturing Technology (2024)

Xingchen LiXiaofan JiaJoon Woo KimSerhat ErdoganKyoung-Sik MoonMatthew B. JordanMadhavan Swaminathan

engineeringmultiple embedded diesmmwave applicationsmanufacturing technologymanufacturingglass interposercomponent technology

Glass Panel Embedding (Gpe) for High-Frequency Applications. IMAPSource Proceedings (2024)

Siddharth RavichandranAtom WatanabeNobuo OguraMadhavan SwaminathanRao Tummala

smart materialsoptical propertiesfibersoptical materialsoptical glassglass photonicsglass materialmaterials scienceapplied physicsthin filmselectronic materialsfunctional glassglass panel embeddinghigh-frequency applicationselectrical engineeringnovel interfaceflexible electronics

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Madhavan Swaminathan

Professor Emeritus

Georgia Institute of Technology

Affiliations

College of Engineering

School of Civil and Environmental Engineering

School of Materials Science and Engineering

School of Civil and Environmental Engineering

Transportation Systems Engineering

Madhavan Swaminathan is currently serving as a College Of Engineering Professor Emeritus at Georgia Institute of Technology.

Honors

Create free account to unlock more features

Experiences

Create free account to unlock more features

Education

Create free account to unlock more features

Madhavan Swaminathan

Georgia Institute of Technology

Professor Emeritus

You can click a keyword to filter the displayed items

Video Presentations

Notable Scholarly Works

Notable Federal Grants

Collaborators

Air-Filled Siws Using Laminate Dielectrics on Glass Substrate for D-Band Applications. IEEE Transactions on Components Packaging and Manufacturing Technology (2024)

Mutee ur RehmanLakshmi Narasimha Vijay KumarSerhat ErdoganMadhavan Swaminathan

A Low Loss Die-Embedded Glass Substrate for 140 Ghz Inp Power Amplifier Integration. 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022 (2024)

Xiaofan JiaXingchen LiJoon Woo KimKyoung-sik MoonMark J.W. RodwellMadhavan Swaminathan

Characterization of Emerging Polymer Dielectric Materials for Advanced Packaging Applications. IEEE Transactions on Components Packaging and Manufacturing Technology (2024)

Shreya DwarakanathPragna BhaskarKimiyuki KannoPratik C NimbalkarMohanalingam KathaperumalMarkondeya Raj PulugurthaMadhavan SwaminathanRao R Tummala

CORRECTION: Nimbalkar Et Al. a Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates. Polymers 2023, 15, 3895. Polymers (2024)

Pratik NimbalkarPragna BhaskarMohanalingam KathaperumalMadhavan SwaminathanRao R. Tummala

redistribution layerspolymer materialspolymer engineeringmaterials sciencepolymer sciencepolymer dielectricspackage substrates

Design and Demonstration of Dual-Core Spiral Package-Embedded Inductors for 48V-To-1V and 12V-To-1V Integrated Voltage Regulators. (2024)

Venkatesh AvulaPrahalad MuraliMadhavan Swaminathan

Design Considerations for DC-DC Voltage Regulators in Distributed Vertical Power Delivery Systems. 2022 IEEE International Symposium on Circuits and Systems (ISCAS) (2024)

Sriharini KrishnakumarMingeun ChoiRamin Rahimzadeh KhorasaniRohit SharmaMadhavan SwaminathanSatish KumarInna Partin-Vaisband

power electronicsenergy storagedc-dc voltage regulatorsdesign considerationselectrical engineering

Efficient Monostatic Anisotropic Point Scatterer Model for High Performance Computing. Journal of Electromagnetic Waves and Applications (2024)

Eric HuangMadhavan Swaminathan

computational electromagneticsapplied mathematicsapplied physicselectromagnetismelectrical engineering

Glass Interposer Integration of Logic and Memory Chiplets: Ppa and Power/Signal Integrity Benefits. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (2024)

Pruek Vanna-IampikulSeungmin WooSerhat ErdoganLingjun ZhuMohanalingam KathaperumalRavi AgarwalRam GuptaKevin RineboldMadhavan SwaminathanSung Kyu Lim

nanoengineeringelectrical engineeringglass interposer integrationmemory chiplets

Glass Interposer With Multiple Embedded Dies for Mmwave Applications. IEEE Transactions on Components Packaging and Manufacturing Technology (2024)

Xingchen LiXiaofan JiaJoon Woo KimSerhat ErdoganKyoung-Sik MoonMatthew B. JordanMadhavan Swaminathan

engineeringmultiple embedded diesmmwave applicationsmanufacturing technologymanufacturingglass interposercomponent technology

Glass Panel Embedding (Gpe) for High-Frequency Applications. IMAPSource Proceedings (2024)

Siddharth RavichandranAtom WatanabeNobuo OguraMadhavan SwaminathanRao Tummala

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10 / page

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computer engineering

reliable vlsi systems

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