Faculty

Institution

Unit

Venue

Muhannad S Bakir

Professor

Georgia Institute of Technology

Affiliations

College of Engineering

School of Civil and Environmental Engineering

Transportation Systems Engineering

Muhannad S Bakir is currently serving as a College Of Engineering Professor at Georgia Institute of Technology.

Honors

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Experiences

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Education

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Muhannad S Bakir

Georgia Institute of Technology

Professor

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electrical engineering materials science engineering optoelectronics microelectronics thermal engineering electronic packaging applied physics manufacturing technology microfluidics component technology advanced manufacturing technologies electronics heat transfer manufacturing printed electronics power electronics manufacturing engineering interconnect (integrated circuits) advanced packaging (semiconductors) photonics device integration microfabrication materials engineering manufacturing science semiconductor device fabrication optical engineering fabrication techniques flexible interconnects micro-electromechanical systems additive manufacturing power delivery thermal management polymer technology micro technology semiconductor devices 3d ic architecture through-silicon vias electronic materials thermal modeling interconnection networks silicon interposer micromechanics gigascale integration polylithic integration silicon interposers design considerations heterogeneous integration medical electronics semiconductor technology sensor technology microfluidic cooling power delivery network compressible microinterconnects reliability engineering manufacturing systems precision engineering accelerator technology system integration rf semiconductor polymer pillars electrical characterization tribology integrated design technology integration fpga design hardware acceleration heterogeneous computing flow boiling lightwave technology light science benchmark studies electronic engineering industrial electronics non-uniform heating liquid cooling biological engineering 3d printing chip on board

Notable Scholarly Works

Notable Federal Grants

Collaborators

Tier Transfer of Ultra-Thin Reconstituted-Sio 2 Chiplet Tiers. IEEE Transactions on Components Packaging and Manufacturing Technology (2025)

Ashita VictorMuhannad S. Bakir

tier transferadvanced packaging (semiconductors)manufacturing technologycomputer engineeringelectronic packagingelectronicsmicroelectronicscomponent technology

Characterization of Warpage of Ultra-Low-K Dielectric Materials and Correlation With Modulus and Coefficient of Thermal Expansion. (2024)

Mohanalingam KathaperumalPragna BhaskarAustin J. ToroPratik NimbalkarLila DahalMuhannad S. Bakir

ultra-low-k dielectric materialsthermal expansionelectrical engineeringcharacterization (materials science)applied physicsmaterials science

Co-Optimization for Robust Power Delivery Design in 3D-Heterogeneous Integration of Compute In-Memory Accelerators. 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (2024)

Ankit KaulMadison ManleyJames ReadYandong LuoXiaochen PengShimeng YuMuhannad Bakir

vlsi designcompute in-memory acceleratorscomputer engineeringelectrical engineeringvlsi circuitelectronicsmicroelectronicsvlsi technology

Design and Thermal Analysis of 2.5D and 3D Integrated System of a Cmos Image Sensor and a Sparsity-Aware Accelerator for Autonomous Driving. IEEE Journal of the Electron Devices Society (2024)

Janak ShardaMadison ManleyAnkit KaulWantong LiMuhannad BakirShimeng Yu

solid-state electronicscomputer engineeringsensor designsystems engineeringembedded systemsoptoelectronicsintegrated systemaccelerator technologycomputer visionelectronicsinstrumentationimage sensorselectrical engineeringsparsity-aware acceleratorcmos image sensorprecision engineeringpower electronicsautonomous drivingsensor technologymicroelectronicsvehicular technology

Design Space Exploration for Power Delivery Network in Next Generation 3D Heterogeneous Integration Architectures. (2024)

Madison ManleyAnkit KaulMuhannad S. Bakir

design space explorationsystems engineeringheterogeneous integration architectures3d printingadvanced designengineeringpower deliveryelectrical engineeringpower delivery network3d ic architecture

Electrical Characterization of Shielded Tsvs With Airgap Isolation for Rf/Mmwave Applications. IEEE Transactions on Components Packaging and Manufacturing Technology (2024)

Shane OhTing ZhengMuhannad S. Bakir

manufacturingadvanced manufacturing technologiestechnologyengineeringshielded tsvsmanufacturing technologyelectrical characterizationelectrical engineeringairgap isolationpower electronicselectronic packagingmanufacturing engineeringcomponent technology

Electrical Demonstration of an Rf Embedded Multi-Chip Module Enabled by Fused-Silica Stitch-Chip Technology. IEEE Transactions on Components Packaging and Manufacturing Technology (2024)

Ting ZhengMuhannad S. Bakir

manufacturingmulti-chip moduleadvanced manufacturing technologieselectrical demonstrationrf subsystemprinted electronicsembedded systemsengineeringmanufacturing technologyelectrical engineeringelectronic packagingfused-silica stitch-chip technologycomponent technologytechnologyradio frequencypower electronicselectronicsrf semiconductormicroelectronics

Electrical–Thermal Co-Analysis of Through-Silicon Vias (Tsvs) Integrated Within Micropin-Fin Heatsink for 3-D Heterogeneous Integration (Hi). IEEE Transactions on Components Packaging and Manufacturing Technology (2024)

Euichul ChungGeyu YanShane OhBharath RamakrishnanHusam AlissaVaidehi OrugantiChristian BeladyMuhannad S. Bakir

micropin-fin heatsinkcomponent technologyelectrical-thermal co-analysiselectrical engineeringelectronic packagingthrough-silicon vias

Electrical-Thermal Co-Analysis of Tsv Embedded Microfluidic Pin-Fin Heatsink for High Power Dissipation With High Bandwidth Density. (2024)

Euichul ChungGeyu YanBharath RamakrishnanHusam AlissaVaidehi OrugantiChristian BeladyErik W. MasselinkMuhannad S. Bakir

thermal engineeringhigh bandwidth densityelectrical-thermal co-analysiselectrical engineeringheat transferhigh power dissipationmicrofluidics

Flexible Emg Arrays With Integrated Electronics for Scalable Electrode Density. bioRxiv (Cold Spring Harbor Laboratory) (2024)

Philip M. AnschutzMuneeb ZiaJiaao LuMatthew J. WilliamsAmanda L. JacobSamuel J. SoberMuhannad S. Bakir

biophysicsflexible emg arraysneurosciencebioelectronicsbiomedical engineeringflexible electronicsintegrated electronics

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Muhannad S Bakir

Professor

Georgia Institute of Technology

Affiliations

College of Engineering

School of Civil and Environmental Engineering

Transportation Systems Engineering

Muhannad S Bakir is currently serving as a College Of Engineering Professor at Georgia Institute of Technology.

Honors

Create free account to unlock more features

Experiences

Create free account to unlock more features

Education

Create free account to unlock more features

Muhannad S Bakir

Georgia Institute of Technology

Professor

You can click a keyword to filter the displayed items

Notable Scholarly Works

Notable Federal Grants

Collaborators

Tier Transfer of Ultra-Thin Reconstituted-Sio 2 Chiplet Tiers. IEEE Transactions on Components Packaging and Manufacturing Technology (2025)

Ashita VictorMuhannad S. Bakir

tier transferadvanced packaging (semiconductors)manufacturing technologycomputer engineeringelectronic packagingelectronicsmicroelectronicscomponent technology

Characterization of Warpage of Ultra-Low-K Dielectric Materials and Correlation With Modulus and Coefficient of Thermal Expansion. (2024)

Mohanalingam KathaperumalPragna BhaskarAustin J. ToroPratik NimbalkarLila DahalMuhannad S. Bakir

ultra-low-k dielectric materialsthermal expansionelectrical engineeringcharacterization (materials science)applied physicsmaterials science

Ankit KaulMadison ManleyJames ReadYandong LuoXiaochen PengShimeng YuMuhannad Bakir

vlsi designcompute in-memory acceleratorscomputer engineeringelectrical engineeringvlsi circuitelectronicsmicroelectronicsvlsi technology

Design and Thermal Analysis of 2.5D and 3D Integrated System of a Cmos Image Sensor and a Sparsity-Aware Accelerator for Autonomous Driving. IEEE Journal of the Electron Devices Society (2024)

Janak ShardaMadison ManleyAnkit KaulWantong LiMuhannad BakirShimeng Yu

Design Space Exploration for Power Delivery Network in Next Generation 3D Heterogeneous Integration Architectures. (2024)

Madison ManleyAnkit KaulMuhannad S. Bakir

design space explorationsystems engineeringheterogeneous integration architectures3d printingadvanced designengineeringpower deliveryelectrical engineeringpower delivery network3d ic architecture

Electrical Characterization of Shielded Tsvs With Airgap Isolation for Rf/Mmwave Applications. IEEE Transactions on Components Packaging and Manufacturing Technology (2024)

Shane OhTing ZhengMuhannad S. Bakir

Electrical Demonstration of an Rf Embedded Multi-Chip Module Enabled by Fused-Silica Stitch-Chip Technology. IEEE Transactions on Components Packaging and Manufacturing Technology (2024)

Ting ZhengMuhannad S. Bakir

Euichul ChungGeyu YanShane OhBharath RamakrishnanHusam AlissaVaidehi OrugantiChristian BeladyMuhannad S. Bakir

micropin-fin heatsinkcomponent technologyelectrical-thermal co-analysiselectrical engineeringelectronic packagingthrough-silicon vias

Electrical-Thermal Co-Analysis of Tsv Embedded Microfluidic Pin-Fin Heatsink for High Power Dissipation With High Bandwidth Density. (2024)

Euichul ChungGeyu YanBharath RamakrishnanHusam AlissaVaidehi OrugantiChristian BeladyErik W. MasselinkMuhannad S. Bakir

thermal engineeringhigh bandwidth densityelectrical-thermal co-analysiselectrical engineeringheat transferhigh power dissipationmicrofluidics

Flexible Emg Arrays With Integrated Electronics for Scalable Electrode Density. bioRxiv (Cold Spring Harbor Laboratory) (2024)

Philip M. AnschutzMuneeb ZiaJiaao LuMatthew J. WilliamsAmanda L. JacobSamuel J. SoberMuhannad S. Bakir

biophysicsflexible emg arraysneurosciencebioelectronicsbiomedical engineeringflexible electronicsintegrated electronics

1
2
3
4
5
29
10 / page

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Similar Faculty Members

Suresh K. Sitaraman

Institution

Georgia Institute of Technology

microfabrication

computer-aided engineering

Rao Tummala

Institution

Georgia Institute of Technology

nanotechnology

medical electronics

Sung-Kyu Lim

Institution

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design

electronic design automation

Mark G. Allen

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nanotechnology

microfabrication

Madhavan Swaminathan

Institution

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electromagnetic compatibility

sustainable development

Saibal Mukhopadhyay

Institution

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computer engineering

reliable vlsi systems

Subramanian S. Iyer

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University of California, Los Angeles

3d ic architecture

memory subsystem integration

Yong-Kyu Yoon

Institution

University of Florida

sensor

microwave engineering

Ali Adibi

Institution

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photonics

materials science

Raj Pulugurtha

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medical electronics

systems packaging