Faculty

Institution

Unit

Venue

Jose E Schutt-Aine

Professor

University of Illinois Urbana-Champaign

Affiliations

The Grainger College of Engineering

Department of Electrical and Computer Engineering

Jose E Schutt-aine is currently serving as an Electrical And Computer Engineering Professor at University of Illinois Urbana-Champaign.

Honors

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Experiences

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Education

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Jose E Schutt-Aine

University of Illinois Urbana-Champaign

Professor

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computer engineering electrical engineering integrated circuits modeling and simulation circuit simulation vlsi circuit engineering microelectronics electromagnetic compatibility latency insertion method computational electromagnetics vlsi technology transmission line systems engineering transmission circuit analysis computational engineering interconnect (integrated circuits) electronic packaging circuit design electronics network analysis microwave technology communications systems high performance computer architecture power delivery transmission system nonlinear analysis transmission lines numerical algorithms numerical mathematics electrical transmission device modeling networked system design nonlinear circuits advanced packaging (semiconductors) scientific computing power electronics vlsi design physical design (electronics) neuromorphic engineering high-frequency devices microwave engineering 3d ic architecture interconnection network architecture brain-like computing radio frequency low latency microwave transmission ultra-low latency computational optimization micro-electromechanical systems network simulation recurrent neural networks nonlinear signal processing computer modeling monte carlo volterra kernels far-end crosstalk neural network circuit simulator precision engineering reduced order modeling stability analysis comparative study boundary element methods numerical method for partial differential equation nonlinear terminations wide tuning range tunable capacitor transient propagation multilayered dielectric medium integral equation z domain pulse propagation modal decomposition signal integrity electronic design automation design automation systems modeling cad tools hardware modeling

Notable Scholarly Works

Notable Federal Grants

Collaborators

AI-Assisted Electro-Thermal Co-Design for Hybrid Bonded Packages. (2025)

Juhitha KonduruSrikanth RangarajanJosé E. Schutt-Ainé

advanced packaging (semiconductors)chip-scale packagethermal engineeringelectronic packaginghybrid bonded packageselectrical engineeringmicroelectronicschip attachmentengineeringheat transfer

Benchmarking and Reproducibility in Computational and Experimental Characterization of Electronic Packages for Signal/Power Integrity: Four Benchmarks Serve as Standardized Cases. IEEE Antennas and Propagation Magazine (2025)

Heidi BarnesKemal AygünMichael J. HillZhichao ZhangKaisheng HuJonatan AronssonPavel PaladhiJayaprakash BalachandranBobi ShiRohit SharmaJosé E. Schutt-AinéVladimir I. Okhmatovski

signal/power integrityreliabilityelectronic packagessignal integrityreliability engineeringcomputer engineeringhardware reliabilityelectronic packagingelectrical engineeringmicroelectronicsdevice reliabilitystandardized casesengineering

Heterogeneous Integration of Memristor Emulator for Low Power Computing. (2025)

Zohreh SalehiHanzhi MaYi ZhouTahsin ShameemJose E. Schutt-Aine

embedded systemscomputer engineeringcomputer architectureintegrated circuitselectrical engineeringmicroelectronicsmemory devicesmemristor emulatorvlsi circuit

Parasitic Extraction and Signal Integrity Analysis of Memristor-Based Crossbar Arrays for Neuromorphic Computing. (2025)

Tahsin Binte ShameemHanzhi MaYi ZhouZohreh SalehiJosé E. Schutt-Ainé

memristor-based crossbar arrayscomputer engineeringneuromorphic engineeringintegrated circuitsneural computationelectronicsneurochipelectrical engineeringmicroelectronicsneural engineeringsignal integrity analysisparasitic extractionvlsi technologyvlsi circuit

Stability of Vinc Lim in Power Distribution Network Analysis. (2025)

José E Schutt-AinéPatrick GohYi Zhou

power system analysiselectric power systemssystems engineeringgrid stabilitypower networkspower deliveryelectrical engineeringnetwork analysisvinc lim

Hybrid Signal Integrity Modeling and Analysis of Heterogeneous Integrated System With Neuromorphic Darwin Chip. IEEE Transactions on Signal and Power Integrity (2024)

Quankun ChenHanzhi MaDa LiTuomin TaoShurun TanEn-Xiao LiuJose Schutt-AineEr-Ping Li

brain-like computingsignal integrityneural circuitsneuromorphic darwin chipcomputer engineeringneuromorphic engineeringcircuit designsignal integrity analysisintegrated circuitsneurochipfield programmable gate arrayneural engineeringvlsi circuitvlsi technologyneurosciencebiomedical circuits

Latency Insertion Method for Accelerated Simulation of Memristor Crossbar Array in Neuromorphic Chip. (2024)

Yi ZhouHanzhi MaJunwei YuTahsin ShameemZohreh SalehiShaloo RakhejaErping LiJosé E. Schutt-Ainé

accelerated simulationmemory architecturescomputer architectureintegrated circuitsneural computationvlsi technologyvlsi circuitlatency insertion methodcomputer engineeringneural engineeringmicroelectronicsemerging memory technologiesneural circuitsneuromorphic engineeringhigh performance computer architectureengineeringin-memory computingelectrical engineeringmemristor crossbar array

Latency Insertion Method for Fast Electro-Thermal Simulation of Finfet With Self-Heating Effect. (2024)

Yi ZhouJosé E. Schutt-Ainé

latency insertion methodcomputer engineeringthermal engineeringthermal modelingintegrated circuitselectronic packagingfast electro-thermal simulationelectrical engineeringmicroelectronicsself-heating effect

Latency Insertion Method for Finfet Simulation Incorporating Parasitic Source/Drain Resistances. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (2024)

Yi ZhouJosé E. Schutt-Ainé

physical design (electronics)circuit simulationlatency insertion methodvlsi designcomputer engineeringintegrated circuitselectrical engineeringmicroelectronicsvlsi technologydevice modelingvlsi circuit

Modeling and Analysis of Heterogeneously Integrated Chiplet-To-Chiplet Communication Link in 2.5D Advanced Packaging. (2024)

Haofeng SunBobi ShiThong NguyenJosé E. Schutt-Ainé

advanced packaging (semiconductors)advanced packagingdouble bow linksinterconnect (integrated circuits)computer engineeringintegrated circuitselectronic packagingvaried bump pitcheschip attachmentengineering

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Jose E Schutt-Aine

Professor

University of Illinois Urbana-Champaign

Affiliations

The Grainger College of Engineering

Department of Electrical and Computer Engineering

Jose E Schutt-aine is currently serving as an Electrical And Computer Engineering Professor at University of Illinois Urbana-Champaign.

Honors

Create free account to unlock more features

Experiences

Create free account to unlock more features

Education

Create free account to unlock more features

Jose E Schutt-Aine

University of Illinois Urbana-Champaign

Professor

You can click a keyword to filter the displayed items

Notable Scholarly Works

Notable Federal Grants

Collaborators

AI-Assisted Electro-Thermal Co-Design for Hybrid Bonded Packages. (2025)

Juhitha KonduruSrikanth RangarajanJosé E. Schutt-Ainé

advanced packaging (semiconductors)chip-scale packagethermal engineeringelectronic packaginghybrid bonded packageselectrical engineeringmicroelectronicschip attachmentengineeringheat transfer

Heidi BarnesKemal AygünMichael J. HillZhichao ZhangKaisheng HuJonatan AronssonPavel PaladhiJayaprakash BalachandranBobi ShiRohit SharmaJosé E. Schutt-AinéVladimir I. Okhmatovski

Heterogeneous Integration of Memristor Emulator for Low Power Computing. (2025)

Zohreh SalehiHanzhi MaYi ZhouTahsin ShameemJose E. Schutt-Aine

embedded systemscomputer engineeringcomputer architectureintegrated circuitselectrical engineeringmicroelectronicsmemory devicesmemristor emulatorvlsi circuit

Parasitic Extraction and Signal Integrity Analysis of Memristor-Based Crossbar Arrays for Neuromorphic Computing. (2025)

Tahsin Binte ShameemHanzhi MaYi ZhouZohreh SalehiJosé E. Schutt-Ainé

Stability of Vinc Lim in Power Distribution Network Analysis. (2025)

José E Schutt-AinéPatrick GohYi Zhou

power system analysiselectric power systemssystems engineeringgrid stabilitypower networkspower deliveryelectrical engineeringnetwork analysisvinc lim

Hybrid Signal Integrity Modeling and Analysis of Heterogeneous Integrated System With Neuromorphic Darwin Chip. IEEE Transactions on Signal and Power Integrity (2024)

Quankun ChenHanzhi MaDa LiTuomin TaoShurun TanEn-Xiao LiuJose Schutt-AineEr-Ping Li

Latency Insertion Method for Accelerated Simulation of Memristor Crossbar Array in Neuromorphic Chip. (2024)

Yi ZhouHanzhi MaJunwei YuTahsin ShameemZohreh SalehiShaloo RakhejaErping LiJosé E. Schutt-Ainé

Latency Insertion Method for Fast Electro-Thermal Simulation of Finfet With Self-Heating Effect. (2024)

Yi ZhouJosé E. Schutt-Ainé

Latency Insertion Method for Finfet Simulation Incorporating Parasitic Source/Drain Resistances. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (2024)

Yi ZhouJosé E. Schutt-Ainé

Modeling and Analysis of Heterogeneously Integrated Chiplet-To-Chiplet Communication Link in 2.5D Advanced Packaging. (2024)

Haofeng SunBobi ShiThong NguyenJosé E. Schutt-Ainé

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