Faculty

Institution

Unit

Venue

John Albrecht

Professor

Michigan State University

Affiliations

College of Engineering

Department of Electrical and Computer Engineering

John Albrecht is currently serving as a College Of Engineering Professor at Michigan State University.

Honors

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Experiences

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Education

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John Albrecht

Michigan State University

Professor

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materials science electrical engineering applied physics optoelectronics solid-state electronics semiconductors electronic materials condensed matter physics microelectronics electronics microwave technology aluminum gallium nitride physics power electronics microwave engineering printed electronics semiconductor technology thin films nanotechnology additive manufacturing semiconductor devices semiconductor nanostructures particle physics manufacturing technology manufacturing electronic packaging condensed matter advanced manufacturing technologies gan power device component technology manufacturing engineering fabrication techniques epitaxial growth radio frequency millimeter wave technology aerosol science piezoelectricity power semiconductor devices semiconductor materials wireless communications thermal engineering semiconductor device fabrication multiferroics gan hemts vlsi technology crystal growth device modeling thermal conductivity phonons molecular beam epitaxy aerosol jet composite science solid-state physics aluminium nitride rf semiconductor novel interface intermittently connected device first principles electron transport fermi kinetics transport charge separation defect formation material modeling charge carrier transport diamond-like carbon monte carlo simulation lattice thermal conductivity p-type silicon electromechanical coupling monte carlo calculation phonon modes viscous interface piezoelectric fields electron transport characteristics bulk zno wurtzite inn electrical insulation electrical properties chemical engineering computational materials science engineering

Notable Scholarly Works

Notable Federal Grants

Collaborators

Aerosol-Jet Printed Transferable Millimeter-Wave Circuits. IEEE Transactions on Components Packaging and Manufacturing Technology (2024)

Wesley SpainJohn PapapolymerouPrem ChahalMatthew HodekJohn D. Albrecht

aerosol transporttransferable millimeter-wave circuits3d printingmicrowave technologycomponent technologytechnologyaerosol scienceadvanced packaging (semiconductors)manufacturing technologyelectrical engineeringelectronic packagingelectronicsprinted electronicsmillimeter wave technologyaerospace engineering

Chemical Mechanical Polishing of Single-Crystalline Diamond Epitaxial Layers for Electronics Applications. IEEE Transactions on Semiconductor Manufacturing (2024)

Aaron HardyMatthias MuehleCristian Herrera-RodriguezMichael BeckerEdward DrownNina BauleMark TompkinsTimothy GrotjohnJohn D. Albrecht

manufacturingchemical mechanical polishingadvanced manufacturing technologieselectronics applicationsepitaxial growthmechanical engineeringoptoelectronicsmanufacturing technologyelectronic materialselectrical engineeringsemiconductor technologyelectronicsprinted electronicsmicroelectronicsmaterials science

Electron–Phonon Coupling and Carrier Relaxation Times in Gallium Antimonide Under Strain. Journal of Electronic Materials (2024)

Nandan TandonJ. D. AlbrechtS. C. Badescu

biophysicscarrier relaxation timesoptoelectronicsapplied physicsgallium antimonidecondensed matter physicsmaterials scienceelectron-phonon coupling

Ku-Band Patch Antenna on Thick, Aerosol Jet Printed Substrate. (2024)

Lucas HendershotMatt HodekPrem ChahalJohn AlbrechtJohn Papapolymerou

wireless communicationsmicrowave antennassystems engineeringantennasunmanned aerial vehiclesaircraftmicrowave technologysensor arraysaerosol scienceaerosol jetku-band patch antennaoptoelectronicsprinted electronicselectrical engineeringsensor placementaerospaceindoor aerosolaerospace engineering

Low-Power Characterization and Integration of Carbon Black Resistive Ink for Aerosol Jet-Printed Rf Components. IEEE Microwave and Wireless Technology Letters (2024)

Koltin GrammerJohn AlbrechtPrem ChahalMatt HodekJohn Papapolymerou

aerosol sciencemechanical engineeringrf subsystemelectronic materialsprinted electronicslow-power characterizationadvanced dielectricsurface characterizationthin filmsmicrowave engineeringmicrowave technologysurface scienceflexible electronicsaerospace engineering3d printingcarbon blackpower electronicsmicroelectronicsmaterials science

A 23 – 32 Ghz Lna With Near 5 W Power Handling Capability Using 180 Nm Gan Hemt Technology. (2023)

Nicholas C. MillerMatthew HodekG. Christopher BarisichEdward GebaraJohn D. AlbrechtJohn Papapolymerou

microwave technologyghz lnarf subsystemelectrical engineeringaluminum gallium nitridesemiconductors

A Power-Efficient Compact Ku-Band System-On-Antenna Module With Chip-First Package Integration. (2023)

Xenofon KonstantinouNicholas SturimJohn D. AlbrechtPremjeet ChahalJohn Papapolymerou

systems engineeringembedded systemsantennasmicrowave technologyprototype implementationelectronicsradio engineeringasic implementationchip-first package integrationadvanced packaging (semiconductors)radio frequencyoptoelectronicselectrical engineeringpower electronicsdigital signal processingmicroelectronicsaerospace engineering

Evaluating Diffusion Barriers of Defects in Boron Ion Implanted Diamond. Diamond and Related Materials (2023)

N. TandonT.A. GrotjohnJ.D. Albrecht

materials engineeringdefect formationnanotechnologymechanical engineeringboron iondiamond-like carbondiffusion barriersapplied physicscondensed matter physicsmaterials science

Fully Aerosol Jet-Printed Passive Components for 140–220-Ghz Operation. IEEE Microwave and Wireless Technology Letters (2023)

Xenofon KonstantinouXing LanKhanh NguyenAlfonso EscorciaRajinder SandhuJesse TiceWesley SpainJohn D. AlbrechtJohn Papapolymerou

microwave engineeringmanufacturingelectrical engineeringmicrowave technology

High Density Multi-Layer Millimeter-Wave Packaging and Interconnects Using Aerosol Jet Printing. (2023)

Nicholas SturimMatt HodekPremjeet ChahalJohn AlbrechtJohn Papapolymerou

additive manufacturing3d printingaerosol jet printingadvanced manufacturing technologiesengineeringfabrication techniquesmanufacturing technologyoptoelectronicsprinted electronicselectrical engineeringelectronic packagingflexible electronicsmicrofabricationmillimeter wave technologymaterials science

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John Albrecht

Professor

Michigan State University

Affiliations

College of Engineering

Department of Electrical and Computer Engineering

John Albrecht is currently serving as a College Of Engineering Professor at Michigan State University.

Honors

Create free account to unlock more features

Experiences

Create free account to unlock more features

Education

Create free account to unlock more features

John Albrecht

Michigan State University

Professor

You can click a keyword to filter the displayed items

Notable Scholarly Works

Notable Federal Grants

Collaborators

Aerosol-Jet Printed Transferable Millimeter-Wave Circuits. IEEE Transactions on Components Packaging and Manufacturing Technology (2024)

Wesley SpainJohn PapapolymerouPrem ChahalMatthew HodekJohn D. Albrecht

Chemical Mechanical Polishing of Single-Crystalline Diamond Epitaxial Layers for Electronics Applications. IEEE Transactions on Semiconductor Manufacturing (2024)

Aaron HardyMatthias MuehleCristian Herrera-RodriguezMichael BeckerEdward DrownNina BauleMark TompkinsTimothy GrotjohnJohn D. Albrecht

Electron–Phonon Coupling and Carrier Relaxation Times in Gallium Antimonide Under Strain. Journal of Electronic Materials (2024)

Nandan TandonJ. D. AlbrechtS. C. Badescu

biophysicscarrier relaxation timesoptoelectronicsapplied physicsgallium antimonidecondensed matter physicsmaterials scienceelectron-phonon coupling

Ku-Band Patch Antenna on Thick, Aerosol Jet Printed Substrate. (2024)

Lucas HendershotMatt HodekPrem ChahalJohn AlbrechtJohn Papapolymerou

Low-Power Characterization and Integration of Carbon Black Resistive Ink for Aerosol Jet-Printed Rf Components. IEEE Microwave and Wireless Technology Letters (2024)

Koltin GrammerJohn AlbrechtPrem ChahalMatt HodekJohn Papapolymerou

A 23 – 32 Ghz Lna With Near 5 W Power Handling Capability Using 180 Nm Gan Hemt Technology. (2023)

Nicholas C. MillerMatthew HodekG. Christopher BarisichEdward GebaraJohn D. AlbrechtJohn Papapolymerou

microwave technologyghz lnarf subsystemelectrical engineeringaluminum gallium nitridesemiconductors

A Power-Efficient Compact Ku-Band System-On-Antenna Module With Chip-First Package Integration. (2023)

Xenofon KonstantinouNicholas SturimJohn D. AlbrechtPremjeet ChahalJohn Papapolymerou

Evaluating Diffusion Barriers of Defects in Boron Ion Implanted Diamond. Diamond and Related Materials (2023)

N. TandonT.A. GrotjohnJ.D. Albrecht

materials engineeringdefect formationnanotechnologymechanical engineeringboron iondiamond-like carbondiffusion barriersapplied physicscondensed matter physicsmaterials science

Fully Aerosol Jet-Printed Passive Components for 140–220-Ghz Operation. IEEE Microwave and Wireless Technology Letters (2023)

Xenofon KonstantinouXing LanKhanh NguyenAlfonso EscorciaRajinder SandhuJesse TiceWesley SpainJohn D. AlbrechtJohn Papapolymerou

microwave engineeringmanufacturingelectrical engineeringmicrowave technology

High Density Multi-Layer Millimeter-Wave Packaging and Interconnects Using Aerosol Jet Printing. (2023)

Nicholas SturimMatt HodekPremjeet ChahalJohn AlbrechtJohn Papapolymerou

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