Faculty

Institution

Unit

Venue

Stephen M. Schultz

Professor

Brigham Young University

Affiliations

Ira A. Fulton College of Engineering

Electrical and Computer Engineering

Stephen M. Schultz is currently serving as an Electrical And Computer Engineering Professor at Brigham Young University.

Honors

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Experiences

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Education

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Stephen M. Schultz

Brigham Young University

Professor

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applied physics optoelectronics optical engineering photonics materials science instrumentation electrical engineering technology sensor technology sensors optical remote sensing sensor design optical metrology wearable technology remote sensing optical sensors wave optics signal processing precision engineering embedded sensing fiber optic sensing polymer science beam optics guided-wave optic polymer technology organic electronics laser processing technology additive manufacturing optic design instrument science fiber science instrumentation engineering laser science slab-coupled optical sensors electronics lightwave technology microwave technology fibers numerical simulations accelerometers electronic instrumentation sensor arrays polymer analysis measurement systems optical information processing bistable compliant mechanisms optical d-fiber high temperature high-speed interrogation dielectric films polydimethylsiloxane layer mobile computing polymer composites thermal engineering distance education electronic packaging interface science wireless communications physiological measurements vehicular technology semiconductor technology wearable electronics low cost sensor radio frequency identification instrument development smart sensors glass fiber electronic color charts preferential-order volume waveguide couplers waveguide coupler line focusing high-efficiency volume metal sheets thin-flexure bistable mechanism d-shaped optical fiber optical materials optical fiber sensors

Notable Scholarly Works

Notable Federal Grants

Collaborators

Imaging Techniques for 3-Dimensional, Non-Line-Of-Sight Structures Fabricated in Silicon Carbide. Metrology (2025)

Jared E. PayneJoseph EddyHunter StevensonGregory N. NielsonStephen Schultz

computational imaging3d imagingmechanical engineeringsilicon carbidenon-line-of-sight structures3d printing

Dynamic Measurement of Ballistic Impact Using an Optical Fibre Sensor. Smart Materials and Structures (2024)

Ivann VelascoFrederick SengGreyson HodgesKara PetersMark PankowStephen Schultz

systems engineeringengineeringstructural engineeringreliability engineeringcontinuous monitoringmechanicsimpact (mechanics)sensorstribologystructural health monitoringnumerical simulationsoptical fibre sensordynamic measurementapplied physicsballistic impactinstrumentation

Fabricating Copper Probe Tips for Vertical Probe Card Using Electroplating and Photolithography. 2022 Intermountain Engineering, Technology and Computing (IETC) (2024)

Noah JohnsonDillon JensenAlexander HorspoolGregory N. NielsonStephen M. Schultz

materials sciencecopper probe tipselectrical engineeringfabrication techniquesvertical probe cardadditive manufacturinginstrumentationmicrofabrication

Fabrication of High Aspect Ratio, Non-Line-Of-Sight Vias in Silicon Carbide by a Two-Photon Absorption Method. Scientific Reports (2024)

Jared E. PaynePeter NyholmRyan BeazerJoseph EddyHunter StevensonBrad FergusonStephen SchultzGregory N. Nielson

materials sciencetwo-photon absorption methodsilicon carbidehigh aspect rationon-line-of-sight viassemiconductor device fabricationelectrical engineeringaerospace engineeringoptoelectronicsphotonics

Fabrication of High Density Flex Cables Using Direct Write Laser Ablation. 2022 Intermountain Engineering, Technology and Computing (IETC) (2024)

Joel KartchnerBrad FergusonDillon JensenJared PayneGregory NielsonStephen Schultz

materials sciencemanufacturing technologylaser processing technologylaser ablationadvanced manufacturing technologieselectrical engineeringmanufacturingadditive manufacturingengineering

Fabrication of Tungsten Probe Tips on a Silicon Carbide Probe Card. 2022 Intermountain Engineering, Technology and Computing (IETC) (2024)

Alexander HorspoolRyan BeazerNoah JohnsonGregory N. NielsonStephen Schultz

materials scienceengineeringtungsten probe tipsmaterials engineeringsolid-state electronicssemiconductor device fabricationelectrical engineeringoptoelectronicsinstrumentation

Foam Pressure Mapping With Optimized Electrodes. Metrology (2024)

Jake SundetJake MerrellMaxwell TreeTrevor ChristensenStephen Schultz

materials sciencemechanical engineeringoptimized electrodeselectrical engineeringoptoelectronicsfoam pressure

Conformal Open-Air Electroplating of Through-Wafer Vias. 2022 Intermountain Engineering, Technology and Computing (IETC) (2023)

Dillon JensenMadeline ThompsonTopher JohnsonGregory N. NielsonStephen M. Schultz

conformal open-air electroplatingoptoelectronicselectrical engineeringthrough-wafer vias

Smartfoam Based Pressure Mapping. 2022 Intermountain Engineering, Technology and Computing (IETC) (2023)

Jake D. SundetJake MerrellStephen M. SchultzMaxwell TreeTrevor Christensen

materials scienceengineeringbiomedical engineeringsurface sciencepressure mappinginstrumentationmicrofluidics

Speeding Up Direct-Write Laser Ablation Process for Microstructures. 2022 Intermountain Engineering, Technology and Computing (IETC) (2023)

Brad FergusonRyan LeeJoseph EddyJared PayneGreg NielsonStephen Schultz

materials sciencemicrostructuremechanical engineeringlaser processing technologylaser ablation

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Stephen M. Schultz

Professor

Brigham Young University

Affiliations

Ira A. Fulton College of Engineering

Electrical and Computer Engineering

Stephen M. Schultz is currently serving as an Electrical And Computer Engineering Professor at Brigham Young University.

Honors

Create free account to unlock more features

Experiences

Create free account to unlock more features

Education

Create free account to unlock more features

Stephen M. Schultz

Brigham Young University

Professor

You can click a keyword to filter the displayed items

Notable Scholarly Works

Notable Federal Grants

Collaborators

Imaging Techniques for 3-Dimensional, Non-Line-Of-Sight Structures Fabricated in Silicon Carbide. Metrology (2025)

Jared E. PayneJoseph EddyHunter StevensonGregory N. NielsonStephen Schultz

computational imaging3d imagingmechanical engineeringsilicon carbidenon-line-of-sight structures3d printing

Dynamic Measurement of Ballistic Impact Using an Optical Fibre Sensor. Smart Materials and Structures (2024)

Ivann VelascoFrederick SengGreyson HodgesKara PetersMark PankowStephen Schultz

Fabricating Copper Probe Tips for Vertical Probe Card Using Electroplating and Photolithography. 2022 Intermountain Engineering, Technology and Computing (IETC) (2024)

Noah JohnsonDillon JensenAlexander HorspoolGregory N. NielsonStephen M. Schultz

materials sciencecopper probe tipselectrical engineeringfabrication techniquesvertical probe cardadditive manufacturinginstrumentationmicrofabrication

Fabrication of High Aspect Ratio, Non-Line-Of-Sight Vias in Silicon Carbide by a Two-Photon Absorption Method. Scientific Reports (2024)

Jared E. PaynePeter NyholmRyan BeazerJoseph EddyHunter StevensonBrad FergusonStephen SchultzGregory N. Nielson

materials sciencetwo-photon absorption methodsilicon carbidehigh aspect rationon-line-of-sight viassemiconductor device fabricationelectrical engineeringaerospace engineeringoptoelectronicsphotonics

Fabrication of High Density Flex Cables Using Direct Write Laser Ablation. 2022 Intermountain Engineering, Technology and Computing (IETC) (2024)

Joel KartchnerBrad FergusonDillon JensenJared PayneGregory NielsonStephen Schultz

materials sciencemanufacturing technologylaser processing technologylaser ablationadvanced manufacturing technologieselectrical engineeringmanufacturingadditive manufacturingengineering

Fabrication of Tungsten Probe Tips on a Silicon Carbide Probe Card. 2022 Intermountain Engineering, Technology and Computing (IETC) (2024)

Alexander HorspoolRyan BeazerNoah JohnsonGregory N. NielsonStephen Schultz

materials scienceengineeringtungsten probe tipsmaterials engineeringsolid-state electronicssemiconductor device fabricationelectrical engineeringoptoelectronicsinstrumentation

Foam Pressure Mapping With Optimized Electrodes. Metrology (2024)

Jake SundetJake MerrellMaxwell TreeTrevor ChristensenStephen Schultz

materials sciencemechanical engineeringoptimized electrodeselectrical engineeringoptoelectronicsfoam pressure

Conformal Open-Air Electroplating of Through-Wafer Vias. 2022 Intermountain Engineering, Technology and Computing (IETC) (2023)

Dillon JensenMadeline ThompsonTopher JohnsonGregory N. NielsonStephen M. Schultz

conformal open-air electroplatingoptoelectronicselectrical engineeringthrough-wafer vias

Smartfoam Based Pressure Mapping. 2022 Intermountain Engineering, Technology and Computing (IETC) (2023)

Jake D. SundetJake MerrellStephen M. SchultzMaxwell TreeTrevor Christensen

materials scienceengineeringbiomedical engineeringsurface sciencepressure mappinginstrumentationmicrofluidics

Speeding Up Direct-Write Laser Ablation Process for Microstructures. 2022 Intermountain Engineering, Technology and Computing (IETC) (2023)

Brad FergusonRyan LeeJoseph EddyJared PayneGreg NielsonStephen Schultz

materials sciencemicrostructuremechanical engineeringlaser processing technologylaser ablation

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laser-induced breakdown

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Harish Subbaraman

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device integration

printed electronics

Xingwei Wang

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University of Massachusetts Lowell

ultrafast pressure sensors

optical ultrasound imaging transducers

Jie Huang

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disaster risk reduction

Thomas K Gaylord

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electromagnetic compatibility

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instrumentation

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photonic crystal

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